Electronic Chip Protective Casing, Ceramic Tube Housing

• Customization: Available
• Transfer Function: All Pass
• Certification: ISO
• Model NO.: customize
• Insulation: >1000V
• Heat Dissipation: 170~240W/(M ·K)
• Air Tightness: 10^-9
• Corrosion Resistance: Superior
• Transport Package: Vacuum Packaging
• Specification: indivual
• Origin: China
• HS Code: 85416000
• Production Capacity: 500000000indivual/Year

Product Description

Product Description

Product Parameters

 

Product Features
Test project
Test category	Inspection items	Test conditions				technical requirement
Environmental resistance	Air tightness	Helium leak detector for checking airtightness				Leakage rate less than 1 * 10^-9Pa. m ³/s
	Temperature shock	After being placed at a high temperature of 155 ± 2 ºC for 10 minutes, and then placed at a low temperature of -65 ± 3 ºC for 10 minutes within a conversion time of 20-30 seconds, the cycle is repeated 5 times				Observing under a 10X microscope, there are no mechanical defects or damages such as cracking or delamination, and the leakage rate is less than 1 * 10^-9 Pa. m ³/s
Coating performance	Plating pattern	Observe using a 10X microscope				Complies with product drawings
	Plating Thickness	Measure using an X-ray fluorescence thickness gauge				Complies with product drawings
	Baking resistance	350 ± 5 ºC heating device, time 5 ± 0.5min				After cooling in room temperature air and observing with a 10X microscope, there are no defects such as discoloration, blistering, peeling, or flaking on the surface of the coating.
	Weldability	Soldering temperature 260 ± 5 ºC, immersion time 5 ± 0.5s				Immersion welding time>95%
	Gold layer adhesion	Test adhesive tape with adhesive strength>1N/cm ², tightly attached to the bottom solder pad, lasting for 10 ± 1 minute, vertically peeled off				There must be no metal objects adhering to the adhesive tape
Electrical performance	insulation resistance	Test voltage: 100 ± 10V, temperature 25 ± 5 ºC				Insulation resistance between leads ≥ 1 * 10^9 0
	Wiring resistance	Test voltage: DC 1.0 ± 0.2V				<1Ω
	Parasitic capacitance	Test voltage: DC 1.0 ± 0.2V, frequency 1MHz				<0.5pF

 

Material properties
project			Company		ceramics		Conductor material
Alumina content			/		92%		W.MO
Water absorption rate			/		<0.01
colour			/		dark gray
bulk density			g/cm³		3.7±0.05
Dielectric constant			/		9.6(1MHZ)
Dielectric loss			/		0.00047(1MHZ)
Flexural strength			Mpa		>430
Thermal conductivity			W		19
Volume resistance			Ωcm		≥1*E+14(20ºC)
					≥1*E+11(300ºC)
Coefficient of thermal expansion			ppm/ºC(100-500ºC)		7
Elastic modulus			MPa		286910
Breakdown strength			KV/mm		≥10

Product features

Product Features
Insulation properties	Good insulation linearity and high reliability. The voltage resistance performance can reach 1000V and can be applied to high-voltage and high-power devices.
Heat dissipation	Low thermal expansion coefficient and high thermal conductivity. The thermal conductivity of AIN ceramic substrate can reach 170-240W/(m · K), and its excellent thermal conductivity greatly improves the heat dissipation of high-power packaged chips compared to organic packaging.
Air tightness	Good airtightness and stable chemical properties. The leakage rate is generally below 10%, which can protect the stable operation of the chip extender.
frequency characteristic	Low dielectric constant and good high-frequency performance. Suitable for optical communication ceramic tube shells, ceramic tube shells for special use, etc.
Corrosion resistance	Superior corrosion resistance ensures that the chip is not affected by the environment when working in high acidity, alkalinity, high salinity, and humidity conditions.

 

Company Profile

 

 

       Our company is a high-tech enterprise specializing in the research and development, production, and sales of chip electronic components, and providing complete solutions for various chip packaging fields using new materials. Mainly targeting electronic materials, electronic pastes, ceramic tube shells, ceramic substrates, ceramic metallization, mold design and development, automation design and development, metal and ceramic forming, gold and ceramic surface treatment, various chip packaging tube shell design and development, production and sales, with process capabilities covering eight major fields such as paste formula development, mold design, automation development, surface electrochemical treatment, sintering, etc. The automated SMD ceramic double-sided indentation treatment equipment independently developed and manufactured by Cijin is currently the first intelligent production line for automated flipping processing and manufacturing in China; And the electroplating line is the industry's first continuous electroplating production line for ceramic thieves, with industry-leading framing and positioning accuracy, and has developed fully automatic six sided appearance inspection equipment.
      The company was established in April 2015, with a factory area of 27500 square meters and more than 500 employees. Among them, 30% are high-end technical R&D personnel, and 10% have a master's degree or above. The company also has complete laboratory, experimental, and testing equipment, and strong scientific research capabilities. Successfully imported SAP ERP, Dassault PLM, OA, and gradually built a digital factory. We mainly produce various specifications and models of PKG (packaging tube shells), Kovar rings, metal cover plates, and metalized ceramic tube shells for special fields. We have successfully provided leading solutions for different fields such as frequency devices, optical communication devices, wave devices, laser devices, CPUs, and sensor devices. At present, there are over 60 patents, including 30 invention patents and 30 utility model patents. The company has successfully applied for national science and technology small and medium-sized enterprises, national high-tech enterprises, robot application enterprises, specialized and new enterprises, and provincial intelligent workshops. The intelligent manufacturing new mode application project in cooperation with the research institute has been awarded the "Digital Workshop for Microelectronics Co fired Ceramic Devices" by the Ministry of Industry and Information Technology of China.
       Our products and solutions have been widely used in smart homes, healthcare, intelligent driving, wireless communication products, GPS positioning, crystal display driven mice, keyboards, Bluetooth speakers, wireless security systems, digital products, industrial control and other fields for customized products.
      The company has a complete and scientific quality and environmental management system, adheres to the concept of innovative development, takes the road of independent innovation, and takes the mission of research and development and catching up with the world's advanced technologies. It is committed to building a high-end electronic component production base, providing services for global intelligent terminals, and providing solutions for global electronic packaging.
 

Certifications

 

 

Packaging & Shipping

 

Product packaging specifications	PRODUCT PACKAGING
	SPECIFICATION
Product packaging and usage specifications
1. The acceptance inspection of the product should be carried out in the purification room. 2. When using the product, work caps, masks, and finger cots should be worn, and plastic tin clips should be used to pick up the product. It is strictly prohibited for the skin to come into direct contact with the product to prevent contamination. 3. When unpacking, use scissors to cut open the packaging bag along the inner side of the heat sealing line, and then slowly extract the product to prevent it from being misplaced and scratched. 4. The opened shell should be stored in a clean moisture-proof cabinet, with a temperature controlled at 25 ºC ± 1 ºC and a relative humidity of ≤ 45%; If not used for a long time, it should be stored in vacuum packaging. The storage device is usually stored for one year, and the temperature in the storage room is controlled at 23 ºC+3 ºC, with a relative humidity of ≤ 70%. 5. Returned products should follow the product packaging process to avoid misalignment and scratches during transportation. 6. The packaging material does not contain oxygen elements.
Product packaging process
1. Load the product into a clean packaging tray. 2. The product tray is packed in a packaging bag and vacuumed. It is recommended to maintain a vacuum degree of 0.03MPa~0.07 MPa, evacuate for 15~25 seconds, seal at a temperature of 150 ± 10 ºC, and seal for 3~4 seconds. 3. Put the packaged product into the packaging box and apply shock-absorbing treatment with pearl cotton. 4. Seal the outer packaging with tape and affix necessary warning signs.

 

FAQ

Q1: Where is your company located? How can I visit there?
A1: Our factory is located in Zhengzhou, China.

Q2: Can I get a sample and how long will it take?
A2: Yes. We can provide free samples, and you will need to pay for the shipping fee. We will send it out approximately 2 days after receiving the payment.  

Q3: What is the minimum order quantity?
A3: Our minimum order quantity is 10000 pieces.

Q4: Can I have my own customized product?
A4: Yes, our company can customize your needs, but the delivery cycle is relatively long, about three months.

Q5: What is the delivery time?
A5: It takes about 15-30 days to complete the order. But the specific time depends on the actual situation.  

Q6: What are the payment terms?
A6: T/T, L/C, etc. (Contact customer service)

Q7: How does your factory conduct quality control?
A7: We attach great importance to quality control. Each part of our product has its own quality control center.  

Q8: How do you establish a long-term and good relationship with our business?
A8: We maintain good quality and competitive prices to ensure that our customers benefit; We respect every customer, just like our friends, and sincerely do business and make friends with them, no matter where they come from.